Invention Grant
- Patent Title: Pillar-shaped semiconductor memory device and method for producing the same
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Application No.: US15637462Application Date: 2017-06-29
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Publication No.: US10199381B2Publication Date: 2019-02-05
- Inventor: Fujio Masuoka , Nozomu Harada
- Applicant: Unisantis Electronics Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- Current Assignee: UNISANTIS ELECTRONICS SINGAPORE PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Brinks Gilson & Lione
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L21/225 ; H01L21/324 ; H01L21/8238 ; H01L23/522 ; H01L23/528 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/78 ; H01L29/66

Abstract:
An SRAM includes three Si pillars. In upper parts of the Si pillars, a first load P-channel, a first driver N-channel, and a first selection N-channel are formed, and in lower parts of the Si pillars, a second load P-channel, a second driver N-channel, and a second selection N-channel are formed. At the same height in the Si pillars, a P+ layer and N+ layers that serve as drains are formed, and these layers are connected to connected gates surrounding the second load P-channel and the second driver N-channel. At the same height in the Si pillars, a P+ layer and N+ layers that serve as drains are formed, and these layers are connected to connected gates surrounding the first load P-channel and the first driver N-channel. Gates surrounding the first and second selection N-channels are connected to a word-line terminal.
Public/Granted literature
- US20170309632A1 PILLAR-SHAPED SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2017-10-26
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