Invention Grant
- Patent Title: Vacuum package, electronic device, and vehicle
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Application No.: US15619802Application Date: 2017-06-12
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Publication No.: US10199515B2Publication Date: 2019-02-05
- Inventor: Hiromu Kawai
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2016-118614 20160615
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; B81B7/00 ; B81C1/00 ; H01L21/44 ; H01L21/46 ; H01L31/09

Abstract:
A vacuum package includes a substrate, a pair of through electrodes that penetrates the substrate, each of the pair of the trough electrodes having first end portion, and a getter that is joined to the first end portions of the pair of the through electrodes, and is heated by electronic conduction via the pair of the through electrodes A portion of the getter between the through electrodes is spaced apart from the substrate.
Public/Granted literature
- US20170365723A1 VACUUM PACKAGE, ELECTRONIC DEVICE, AND VEHICLE Public/Granted day:2017-12-21
Information query
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