A light-emitting device includes: a resin package including: a first lead, a second lead, and a resin portion, wherein each of the first lead and the second lead has a top surface and a bottom surface and comprises a metal layer formed at least at the top surfaces; a light-emitting element electrically connected to the first lead and the second lead; and a protection element located on a first surface portion of the top surface of the first lead. The first lead includes: a first lateral portion and at least one second lateral portion. A second surface portion is formed at the top surface of the first lead between the protection element and at least one of the first lateral portion and the at least one second lateral portion, the second surface portion being embedded in the resin portion and extending in a height direction.