Electrode terminals are provided. The electrode terminal includes a copper substrate and a metal layer covering at least one surface of the copper substrate, wherein the metal layer includes greater than or equal to about 10 wt % and less than or equal to about 80 wt % of tungsten (W), and an additional metal comprising nickel (Ni), silver (Ag), gold (Au), platinum (Pt), zinc (Zn), iron (Fe), lead (Pb), tin (Sn), molybdenum (Mo), beryllium (Be), rhodium (Rh), iridium (Ir), or a combination thereof. An electro-chemical device and an electro-chemical device module including the same are also provided.