Invention Grant
- Patent Title: Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same
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Application No.: US15208655Application Date: 2016-07-13
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Publication No.: US10201077B2Publication Date: 2019-02-05
- Inventor: Yuu Sugimoto , Hiroyuki Tanabe , Naohiro Terada
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2015-139801 20150713
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01L23/522 ; H05K1/02 ; H05K1/11 ; H05K3/42 ; H05K3/00 ; G01R1/04 ; G11B5/48

Abstract:
A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
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