Invention Grant
- Patent Title: Contact element and contact structure for electronic device
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Application No.: US15689206Application Date: 2017-08-29
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Publication No.: US10201088B2Publication Date: 2019-02-05
- Inventor: Jin Yong Park , Jeong Geun Kim , Si Young Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0126976 20160930
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K1/18 ; H01R4/58 ; H05K1/11 ; H05K3/34 ; H05K1/02 ; H05K7/14 ; H05K1/14

Abstract:
In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.
Public/Granted literature
- US20180098431A1 CONTACT ELEMENT AND CONTACT STRUCTURE FOR ELECTRONIC DEVICE Public/Granted day:2018-04-05
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