Invention Grant
- Patent Title: Connector assembly
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Application No.: US16032410Application Date: 2018-07-11
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Publication No.: US10201112B1Publication Date: 2019-02-05
- Inventor: Ted Ju , Chin Chi Lin
- Applicant: LOTES CO., LTD
- Applicant Address: TW Keelung
- Assignee: LOTES CO., LTD
- Current Assignee: LOTES CO., LTD
- Current Assignee Address: TW Keelung
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN201720851266U 20170714
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H05K7/20 ; H01R13/6581 ; H01R13/6594 ; H01R13/502 ; H01R12/71 ; H01R24/60 ; H01R107/00

Abstract:
A connector assembly includes: a socket connector and a plug connector. The socket connector includes a main body having a tongue, multiple mating terminals, and a first thermal conduction member. The tongue has two first surfaces arranged opposite to each other. Each mating terminal has a first contact portion, and the first contact portions are exposed from at least one of the first surfaces. The first thermal conduction member has a first mating portion exposed from the at least one first surface provided with the first contact portions. The plug connector includes: a circuit board; a chip provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member provided on the insulating body. The second thermal conduction member has a second mating portion and a conducting portion thermally conducted with the chip.
Public/Granted literature
- US20190021185A1 CONNECTOR ASSEMBLY Public/Granted day:2019-01-17
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