Invention Grant
- Patent Title: Removable board with cooling system for chassis-based electronic equipment
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Application No.: US15932186Application Date: 2018-02-16
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Publication No.: US10201114B2Publication Date: 2019-02-05
- Inventor: Boris Reynov , Shreeram Siddhaye , Venkata S. Raju Penmetsa
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Harrity & Harrity, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.
Public/Granted literature
- US20180192544A1 Removable board with cooling system for chassis-based electronic equipment Public/Granted day:2018-07-05
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