Invention Grant
- Patent Title: Lead frame
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Application No.: US15880011Application Date: 2018-01-25
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Publication No.: US10201917B2Publication Date: 2019-02-12
- Inventor: Kentaro Kaneko , Tsuyoshi Kobayashi , Yoshio Furuhata , Shigeri Nakamura
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-Shi
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-Shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2017-028221 20170217
- Main IPC: H01L23/495
- IPC: H01L23/495 ; B29C37/02 ; H01L23/50 ; H01L21/48 ; H01L21/67 ; H01L23/492
Abstract:
A lead frame includes an outer frame. The outer frame includes: one surface; another surface that is opposite to the one surface; a side surface between the one surface and the other surface; a recess that is formed to extend from the one surface to the side surface; and a notch step portion that is formed to extend from the other surface to the side surface.
Public/Granted literature
- US20180236696A1 LEAD FRAME Public/Granted day:2018-08-23
Information query
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