The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate using a mold and forming a pattern on the substrate, the apparatus including a substrate chuck configured to hold the substrate, a protective plate configured to surround the substrate chuck, and a suction mechanism configured to suction at least a part of a gap between the substrate chuck and the protective plate, wherein while the suction mechanism suctions at least the part of the gap, the substrate chuck holds a plate which is different from the substrate on which the pattern is to be formed.