A separation welding device for the sectional joining and sectional separation of weldable film layers includes a temperature-controlled working surface that is designed to support joinable and separable film layers and further includes an electrical heating device as well as a counterholder for sectionally applying pressure to the joinable and separable film layers, which delimits a variably adjustable working gap with the working surface and that includes two mutually spaced joining stamps and one separating stamp arranged between the joining stamps wherein the separating stamp and/or at least one joining stamp is moveably attached to the counterholder wherein provision can be made for the separating stamp and/or the joining stamp to each be assigned a force sensor and/or a motion sensor to calculate a separation sequence determined by the separating stamp and/or a joining sequence determined by the joining stamp.