Invention Grant
- Patent Title: Polyamide-imide resin, and curable resin composition and cured product of same
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Application No.: US14905388Application Date: 2014-07-15
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Publication No.: US10202493B2Publication Date: 2019-02-12
- Inventor: Kouichi Murakami , Atsushi Miyagaki
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2013-149409 20130718
- International Application: PCT/JP2014/068774 WO 20140715
- International Announcement: WO2015/008744 WO 20150122
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C08L63/00 ; C08L79/08 ; C08G73/10

Abstract:
Provided are a thermosetting resin composition which is soluble in a general-purpose solvent and which can obtain a cured product (cured film) having high optical transparency to the ultraviolet region (approximately 300 nm) from the visible region, and a polyamide-imide resin suitable for use in preparing the thermosetting resin composition. Specifically, provided are an alcohol-modified polyamide-imide resin, which is obtained by reacting an isocyanurate type polyisocyanate (a1) synthesized from an isocyanate having an aliphatic structure with a tricarboxylic anhydride (a2) to prepare a polyamide-imide resin (a), and then reacting the polyamide-imide resin (a) with an alcohol compound (b); a curable resin composition containing the polyamide-imide resin; and a cured product of the curable resin composition.
Public/Granted literature
- US20160152773A1 POLYAMIDE-IMIDE RESIN, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME Public/Granted day:2016-06-02
Information query
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