Invention Grant
- Patent Title: Method and assembly for mounting and supporting a conduit
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Application No.: US15611735Application Date: 2017-06-01
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Publication No.: US10202991B2Publication Date: 2019-02-12
- Inventor: Christopher Lewis
- Applicant: Wencon Development, Inc.
- Applicant Address: US CA Walnut Creek
- Assignee: Wencon Development, Inc.
- Current Assignee: Wencon Development, Inc.
- Current Assignee Address: US CA Walnut Creek
- Agency: Temmerman Law Office
- Agent Mathew J. Temmerman
- Main IPC: F16B2/06
- IPC: F16B2/06 ; F16L3/12 ; F16L3/137 ; F16L3/10 ; F16L3/237 ; F16L3/223

Abstract:
A method and assembly for mounting a conduit on a mounting surface utilizing a conduit mounting assembly. The conduit mounting assembly includes a first clamp portion, a second clamp portion, a connecting screw and a conduit securement screw. The method includes providing the conduit mounting assembly, mounting the first clamp portion on a tile, mounting the second clamp portion opposite to the first clamp portion on the tile, connecting the first clamp portion with the second clamp portion utilizing the connecting screw and mounting the conduit on the second clamp portion utilizing the conduit securement screw and a conduit fastening member.
Public/Granted literature
- US20180347602A1 METHOD AND ASSEMBLY FOR MOUNTING AND SUPPORTING A CONDUIT Public/Granted day:2018-12-06
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