Invention Grant
- Patent Title: Optical semiconductor module
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Application No.: US15688717Application Date: 2017-08-28
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Publication No.: US10203460B2Publication Date: 2019-02-12
- Inventor: Hideto Furuyama , Yoichiro Kurita , Hiroshi Uemura , Fumitaka Ishibashi
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP2016-217420 20161107
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/32 ; G02B6/34

Abstract:
An optical semiconductor module includes a resin body having a first surface and an opposed second surface, an optical device having a third surface and a fourth surface opposite the third surface, the optical device comprising an optical element located at the fourth surface, the optical element capable of at least one of receiving light from, and transmitting light through, the third surface, a first terminal located at the first surface of the resin body, and an electrical connection between the first terminal and the optical device, the electrical connection embedded in the resin body.
Public/Granted literature
- US20180128998A1 OPTICAL SEMICONDUCTOR MODULE Public/Granted day:2018-05-10
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