An electronic component is equipped with a pad. The pad includes a lower transparent electric conductive layer formed on an insulating substrate. An insulating layer is formed on the lower transparent electric conductive layer. A contact hole is formed in the insulating layer for exposing the lower layer transparent electric conductive layer. A metal layer is formed on the lower transparent electric conductive layer and covered with the insulating layer so as to surround the contact hole. An upper transparent electric conductive layer is formed on the insulating layer and connected with the lower transparent electric conductive layer through the contact hole.