Invention Grant
- Patent Title: Apparatus and method for dispensing developer onto semiconductor substrate
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Application No.: US15873944Application Date: 2018-01-18
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Publication No.: US10203606B1Publication Date: 2019-02-12
- Inventor: Chia-Cheng Chao , Chung-Cheng Wang , Chun-Kuang Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G03D3/00
- IPC: G03D3/00 ; G03F7/30 ; G03F7/16

Abstract:
A dispensing head for dispensing a developer onto a substrate is provided. The dispensing head includes a housing configured to receive the developer. The dispensing head further includes at least one liquid outlet provided on the housing. The liquid outlet is configured to spray the developer onto an elongated area on the substrate. Also, the liquid outlet is configured to spray the developer along a dispensing direction that is tilted with respect to the normal direction of the substrate and perpendicular to the long-axis direction of the elongated area.
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