A method for producing a thin substrate layer having a thickness of at most 100 μm by detaching a substrate layer from the ingot by producing a tensile stress induction on an ingot, and wherein the tensile stress induction is effected by a stressor layer structure integrally bonded to a first surface of the ingot. The stressor layer structure and the ingot have different thermal expansion coefficients, and the stressor layer structure is removed from the substrate layer after detachment of the substrate layer from the ingot. The stressor layer structure has at least one layer sequence with a first titanium-containing layer and a nickel-containing layer. The titanium-containing layer adjoins with a bottom side a first surface of the ingot and the nickel-containing layer adjoins with a bottom side a top side of the titanium-containing layer.