An object of the present invention is to provide a power module that secures a heat dissipation route and has increased reliability. A power module of the present invention includes a first circuit body having a first semiconductor element and a first conductor portion, a second circuit body having a second semiconductor element and a second conductor portion, a resin sealing material for sealing the first circuit body and the second circuit body, and a warpage suppression portion that is formed along an array direction of the first circuit body and the second circuit body and is formed to have greater rigidity than a sealing portion of the resin sealing material, wherein the warpage suppression portion is formed of the same material as a resin member of the resin sealing material and is formed to be thicker than the sealing portion of the resin sealing material.