Invention Grant
- Patent Title: Corrosion resistant aluminum bond pad structure
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Application No.: US15899755Application Date: 2018-02-20
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Publication No.: US10204877B2Publication Date: 2019-02-12
- Inventor: Charles L. Arvin , Jeffrey P. Gambino , Charles F. Musante , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C22C21/00
Abstract:
A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer.
Public/Granted literature
- US20180174988A1 CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE Public/Granted day:2018-06-21
Information query
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