Invention Grant
- Patent Title: Transistor with airgap spacer
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Application No.: US15743847Application Date: 2015-07-17
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Publication No.: US10204999B2Publication Date: 2019-02-12
- Inventor: Chen-Guan Lee , Joodong Park , En-Shao Liu , Everett S. Cassidy-Comfort , Walid M. Hafez , Chia-Hong Jan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- International Application: PCT/US2015/040936 WO 20150717
- International Announcement: WO2017/014725 WO 20170126
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/764 ; H01L29/66 ; H01L29/78 ; H01L21/768

Abstract:
A microelectronic transistor may be fabricated having an airgap spacer formed as a gate sidewall spacer, such that the airgap spacer is positioned between a gate electrode and a source contact and/or a drain contact of the microelectronic transistor. As the dielectric constant of gaseous substances is significantly lower than that of a solid or a semi-solid dielectric material, the airgap spacer may result in minimal capacitive coupling between the gate electrode and the source contact and/or the drain contact, which may reduce circuit delay of the microelectronic transistor.
Public/Granted literature
- US20180197966A1 TRANSISTOR WITH AIRGAP SPACER Public/Granted day:2018-07-12
Information query
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