Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US15664353Application Date: 2017-07-31
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Publication No.: US10205008B2Publication Date: 2019-02-12
- Inventor: Toshimitsu Obonai , Hironobu Takahashi , Yasuharu Hosaka , Masahiro Watanabe , Takuya Handa , Yukinori Shima , Takashi Hamochi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2016-152814 20160803; JP2016-161213 20160819; JP2016-233419 20161130
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/336 ; H01L29/66 ; H01L21/02 ; H01L21/67

Abstract:
Provided is a semiconductor device with favorable electrical characteristics. Provided is a semiconductor device with stable electrical characteristics. Provided is a manufacturing method of a semiconductor device with a high yield. The manufacturing method includes a first step of forming an insulating film over a substrate, a second step of transferring the substrate in an atmospheric atmosphere, a third step of heating the insulating film, and a fourth step of forming a metal oxide film. The third step and the fourth step are successively performed in an atmosphere where water vapor partial pressure is lower than water vapor partial pressure in the atmospheric air.
Public/Granted literature
- US20180040722A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2018-02-08
Information query
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