Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15983040Application Date: 2018-05-17
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Publication No.: US10205010B2Publication Date: 2019-02-12
- Inventor: Toru Muramatsu , Hong-fei Lu , Haruo Nakazawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2015-161022 20150818; JP2016-123882 20160622
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L21/265 ; H01L29/417 ; H01L29/06 ; H01L21/225 ; H01L29/10

Abstract:
A semiconductor device is provided, the semiconductor device including a base layer of a first conductivity type having a MOS gate structure formed on a front surface side thereof, a collector layer of a second conductivity type formed on a rear surface side of the base layer, and into which a first dopant and a second dopant which is different from the first dopant are implanted, and a collector electrode formed on a rear surface side of the collector layer, wherein an impurity concentration peak of the second dopant is at a deeper position from the rear surface of the collector layer than an impurity concentration peak of the first dopant, and magnitude of the impurity concentration peak of the second dopant is larger than 1/100 of magnitude of the impurity concentration peak of the first dopant.
Public/Granted literature
- US20180269314A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-09-20
Information query
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