- Patent Title: Semiconductor device having a fin at a side of a semiconductor body
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Application No.: US15163428Application Date: 2016-05-24
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Publication No.: US10205019B2Publication Date: 2019-02-12
- Inventor: Andreas Meiser , Christian Kampen
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/225 ; H01L29/06 ; H01L21/22 ; H01L27/12 ; H01L29/10 ; H01L29/417

Abstract:
One embodiment of a semiconductor device includes a fin at a first side of a semiconductor body, a body region of a second conductivity type in at least a part of the fin, a drain extension region of a first conductivity type, a source region and a drain region of the first conductivity type, a source contact in contact with the source region, and a gate structure adjoining opposing walls of the fin. The source contact extends along a vertical direction along the source region. The source contact includes a conductive material and is disposed in a trench in the semiconductor body, adjacent to the source region. The body region and the drain extension region are arranged one after another between the source region and the drain region.
Public/Granted literature
- US20160268425A1 Semiconductor Device Having a Fin at a Side of a Semiconductor Body Public/Granted day:2016-09-15
Information query
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