Invention Grant
- Patent Title: Photodiode device and manufacturing method thereof
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Application No.: US15618748Application Date: 2017-06-09
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Publication No.: US10205037B2Publication Date: 2019-02-12
- Inventor: Yuichiro Yamashita , Hsueh-Liang Chou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C. Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0236 ; H01L31/18 ; H01L31/0352 ; H01L31/02 ; H01L31/107

Abstract:
The present disclosure provides a photodiode device, which includes a semiconductor substrate, a well region in the semiconductor substrate of a first dopant type, a first doped region of the first dopant type in the well region, and a second doped region of a second dopant type disposed in the well region and over the first doped region. The second doped region comprises first recesses exposed through a surface of the second doped region, and a first portion of the second doped region on the surface comprises a first doping concentration of the second dopant type greater than a second doping concentration of a second portion of the second doped region away from the first recesses.
Public/Granted literature
- US20180358488A1 PHOTODIODE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-12-13
Information query
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