Invention Grant
- Patent Title: Thermal insulation waveguide and wireless communication device
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Application No.: US15259395Application Date: 2016-09-08
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Publication No.: US10205211B2Publication Date: 2019-02-12
- Inventor: Tamio Kawaguchi , Noritsugu Shiokawa , Hiroaki Ikeuchi , Tadahiro Sasaki , Kohei Nakayama , Mutsuki Yamazaki , Hiroyuki Kayano
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2015-180840 20150914
- Main IPC: H01P5/02
- IPC: H01P5/02 ; G01S7/03 ; G01S7/02

Abstract:
A thermal insulation waveguide between a high-temperature unit and a low-temperature unit in a vacuum, chamber of an embodiment, the thermal insulation waveguide includes, a first substrate including a first line in the high-temperature unit, a second substrate including a second line in the low temperature unit, and a thermal insulation element connecting the substrates, and including a third line including an inductance component and connecting the first and second lines. The first substrate includes a first capacitor unit connected with the first line. The second substrate includes a second capacitor unit connected with the second line.
Public/Granted literature
- US20170077580A1 THERMAL INSULATION WAVEGUIDE AND WIRELESS COMMUNICATION DEVICE Public/Granted day:2017-03-16
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