Invention Grant
- Patent Title: Packaging structure for four-channel integrated tunable laser array chip
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Application No.: US15740673Application Date: 2015-06-29
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Publication No.: US10205298B2Publication Date: 2019-02-12
- Inventor: Chao Liu
- Applicant: Hebei Hymax Optoelecttronics Inc.
- Applicant Address: CN Zhangjiakou
- Assignee: Hebei Hymax Optoelectronics Inc.
- Current Assignee: Hebei Hymax Optoelectronics Inc.
- Current Assignee Address: CN Zhangjiakou
- Agency: Fox Rothschild LLP
- International Application: PCT/CN2015/082680 WO 20150629
- International Announcement: WO2017/000130 WO 20170105
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/024 ; H01S5/026 ; H01S5/042 ; H01S5/068 ; H01S5/125

Abstract:
A packaging structure for a four-channel integrated tunable laser array chip (100) comprises a carrier (200), a cryogenic refrigerator (300), a lens assembly (400), an isolator assembly (500), a package (600), a transition ring (700), and a thermistor. The packaging structure for the four-channel integrated tunable laser array chip (100) can realize a flexible tuning upon an active coupling of optical paths and ensure a reasonable switching of optical paths between optical assemblies, thereby improving a coupling efficiency for the optical paths and increasing a transmission distance of a digital signal. Furthermore, a design of a radio frequency circuit ensures integrity of a transmitted signal and reduces loss during the transmission.
Public/Granted literature
- US20180191130A1 PACKAGING STRUCTURE FOR FOUR-CHANNEL INTEGRATED TUNABLE LASER ARRAY CHIP Public/Granted day:2018-07-05
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