A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.