Invention Grant
- Patent Title: Power module assembly and manifold
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Application No.: US15810612Application Date: 2017-11-13
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Publication No.: US10206314B2Publication Date: 2019-02-12
- Inventor: Guangyin Lei , Michael W. Degner , Tienli Wang , Edward Chan-Jiun Jih
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent David B. Kelley
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F9/02 ; F28F9/00 ; H01H9/52 ; H01L23/473 ; F28D9/00

Abstract:
A vehicle power module assembly including a stacked array of module frames, a manifold, and a pair of endplates is provided. The stacked array of module frames may each define a passthrough in registration with other of the passthroughs to define a manifold cavity, a power stage cavity, and a plurality of outlets open to the respective passthroughs and oriented relative to the power stage cavities to deliver coolant therebetween. The manifold may be disposed within the manifold cavity and defines a manifold inlet open to an inlet chamber and manifold ports for alignment with the plurality of outlets. One of the endplates may define an inlet open to the manifold inlet and another one of the endplates may define an outlet open to a manifold outlet. The inlets, outlets, and ports are arranged with one another to provide a coolant path between the endplate inlet and endplate outlet.
Public/Granted literature
- US20180070481A1 Power Module Assembly and Manifold Public/Granted day:2018-03-08
Information query