Method for forming a laser processed hole
Abstract:
A method for forming a laser processed hole in a workpiece configured by bonding a transparent first member formed of a first material and a second member formed of a second material. The method includes holding the workpiece by a chuck table with a side of the first member directed upward; applying a pulsed laser beam to the workpiece from the upward side of the first member; detecting a wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; and controlling the laser beam according to a detection signal from the plasma light. The plasma is detected by: passing only the wavelength of plasma light generated from the first material, and detecting the plasma light generated from the first material and outputting a light intensity signal based on the detection. The processed hole extends entirely through the first member without melting the second member.
Public/Granted literature
Information query
Patent Agency Ranking
0/0