Invention Grant
- Patent Title: Method for forming a laser processed hole
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Application No.: US15080958Application Date: 2016-03-25
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Publication No.: US10207369B2Publication Date: 2019-02-19
- Inventor: Keiji Nomaru , Hiroshi Morikazu
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2012-015806 20120127
- Main IPC: B23K26/03
- IPC: B23K26/03 ; B23K26/38 ; B23K26/384 ; B23K26/0622 ; H01L21/768 ; G01N21/71 ; B23K26/40 ; B23K26/382 ; B23K103/16

Abstract:
A method for forming a laser processed hole in a workpiece configured by bonding a transparent first member formed of a first material and a second member formed of a second material. The method includes holding the workpiece by a chuck table with a side of the first member directed upward; applying a pulsed laser beam to the workpiece from the upward side of the first member; detecting a wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; and controlling the laser beam according to a detection signal from the plasma light. The plasma is detected by: passing only the wavelength of plasma light generated from the first material, and detecting the plasma light generated from the first material and outputting a light intensity signal based on the detection. The processed hole extends entirely through the first member without melting the second member.
Public/Granted literature
- US20160199940A1 LASER PROCESSING APPARATUS Public/Granted day:2016-07-14
Information query
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