- Patent Title: Method for bonding components by using energy ray-curable adhesive
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Application No.: US15049631Application Date: 2016-02-22
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Publication No.: US10207457B2Publication Date: 2019-02-19
- Inventor: Shunichi Odaka
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Fredrikson & Byron, P.A.
- Priority: JP2015-039096 20150227
- Main IPC: B29C65/48
- IPC: B29C65/48 ; G01D5/347 ; B29C65/14 ; B29C65/00 ; F16B11/00 ; B29L31/00

Abstract:
A method for bonding components to each other according to this invention bonds, to a plate-shaped member or a shaft, an ultraviolet-curable adhesive cured by irradiation with ultraviolet rays and a wavelength conversion element which emits ultraviolet rays by irradiation with X-rays. The plate-shaped member is brought into contact with the shaft through a bonding layer formed by the ultraviolet-curable adhesive and the wavelength conversion element. The X-rays are transmitted through the plate-shaped member or the shaft to the bonding layer located between the plate-shaped member and the shaft to cure the ultraviolet-curable adhesive.
Public/Granted literature
- US20160250802A1 METHOD FOR BONDING COMPONENTS BY USING ENERGY RAY-CURABLE ADHESIVE Public/Granted day:2016-09-01
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