A thermally conductive foam sheet for electronic equipment according to the present invention is a sheet-shaped foam sheet comprising a silicone resin (A), and thermal conductor particles (B) and bubbles dispersed in the silicone resin (A), wherein a content of the thermal conductor particles (B) is 100 to 400 parts by mass based on 100 parts by mass of the silicone resin (A), and the foam sheet further has a 25% compressive strength of 200 kPa or less and a thickness of 0.8 mm or less.