- Patent Title: Manufacturing method of joined body, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing device of joined body
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Application No.: US15660643Application Date: 2017-07-26
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Publication No.: US10207484B2Publication Date: 2019-02-19
- Inventor: Hiroyuki Tsuchiya
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2016-161045 20160819; JP2016-246277 20161220
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B81C3/00 ; C09J5/00 ; B32B37/12

Abstract:
A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing.
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