Invention Grant
- Patent Title: MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
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Application No.: US15405540Application Date: 2017-01-13
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Publication No.: US10207503B2Publication Date: 2019-02-19
- Inventor: Motoki Takabe , Shingo Tomimatsu , Shunsuke Watanabe
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2016-008506 20160120
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H01L41/047 ; H01L41/29 ; B41J2/16

Abstract:
A MEMS device includes a first substrate provided with a plurality of first electrode terminals and a second substrate composed of a crystalline substrate and provided with a plurality of second electrode terminals respectively corresponding to the first electrode terminals. The first electrode terminals and the second electrode terminals are electrically bonded one-to-one. Protrusions are formed at positions corresponding to the first electrode terminals on a mounting face of the second substrate opposing the first substrate. The second electrode terminals include the protrusions and conductive material covering the protrusions.
Public/Granted literature
- US20180111372A1 MEMS Device, Liquid Ejecting Head, Liquid Ejecting Apparatus, and MEMS Device Manufacturing Method Public/Granted day:2018-04-26
Information query
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