Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).