A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.