Invention Grant
- Patent Title: Thermosetting resin composition and uses thereof
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Application No.: US15028578Application Date: 2013-10-11
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Publication No.: US10208188B2Publication Date: 2019-02-19
- Inventor: Cuiming Du , Liangpeng Hao , Songgang Chai
- Applicant: SHENGYI TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: SHENGYI TECHNOLOGY CO., LTD.
- Current Assignee: SHENGYI TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: McDonald Hopkins LLC
- International Application: PCT/CN2013/085071 WO 20131011
- International Announcement: WO2015/051541 WO 20150416
- Main IPC: B32B3/10
- IPC: B32B3/10 ; C08K5/5398 ; C08J5/24 ; C08G59/40 ; C08K13/02 ; C08L63/00 ; C08L83/04 ; H05K1/03 ; C08J5/10 ; C08G59/06 ; C08K3/22 ; C08K3/36 ; C08K5/05 ; C08K5/39 ; C08G59/24 ; C08G59/68 ; B32B15/08 ; B32B27/20 ; C08L61/04 ; C08G77/12 ; C08G77/20
Abstract:
A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
Public/Granted literature
- US20160229990A1 THERMOSETTING RESIN COMPOSITION AND USES THEREOF Public/Granted day:2016-08-11
Information query
