Invention Grant
- Patent Title: Adhesive composition
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Application No.: US14888949Application Date: 2014-05-06
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Publication No.: US10208232B2Publication Date: 2019-02-19
- Inventor: Shujun J. Wang , Zhong Chen , John R. Jacobsen , Peggy S. Willett , David J. Yarusso , Soyoung Kim
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Kent S. Kokko
- International Application: PCT/US2014/036892 WO 20140506
- International Announcement: WO2014/186169 WO 20141120
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J133/10 ; C08F265/06 ; C09J151/00 ; C09J7/38 ; C08L33/08 ; C08L33/10
Abstract:
Disclosed is a crosslinked adhesive composition comprising a low Tg (meth)acrylate copolymer component, a high Tg (meth)acrylate copolymer component, and a hydrogenated hydrocarbon tackifier. This disclosure provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles that are particularly useful in the bonding of low surface energy (LSE) substrates.
Public/Granted literature
- US20160083629A1 ADHESIVE COMPOSITION Public/Granted day:2016-03-24
Information query
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