Invention Grant
- Patent Title: Low cost apparatus for insitu testing of packaged integrated circuits during stressing
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Application No.: US14992148Application Date: 2016-01-11
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Publication No.: US10209297B2Publication Date: 2019-02-19
- Inventor: Ning Tan , Jose Abdiel Rodriguez-Latorre
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/04
Abstract:
An apparatus with a burn-in board containing a microcontroller unit and a heater socket for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of multiple packaged integrated circuits while under stress.
Public/Granted literature
- US20170199238A1 Low Cost Apparatus for Insitu Testing of Packaged Integrated Circuits During Stressing Public/Granted day:2017-07-13
Information query
