- Patent Title: Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method
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Application No.: US15655932Application Date: 2017-07-21
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Publication No.: US10209614B2Publication Date: 2019-02-19
- Inventor: Kazuhiro Hamamoto , Yoichi Usui
- Applicant: HOYA CORPORATION
- Applicant Address: JP Shinjuku-ku, Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Shinjuku-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-202494 20130927
- Main IPC: B32B7/02
- IPC: B32B7/02 ; G03F1/24 ; G03F1/38 ; G03F7/20

Abstract:
A conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70-BA30)/(BD70-BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
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