Invention Grant
- Patent Title: Exposure method and device manufacturing method having lower scanning speed to expose peripheral shot area
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Application No.: US13067046Application Date: 2011-05-04
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Publication No.: US10209622B2Publication Date: 2019-02-19
- Inventor: Hiroyuki Nagasaka
- Applicant: Hiroyuki Nagasaka
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2003-297507 20030821; JP2004-038411 20040216
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
An exposure method sequentially exposes a plurality of shot areas of a substrate. The method includes: (i) holding the substrate on a substrate holder such that a gap is formed along an edge of the substrate; (ii) exposing one of the shot areas, located near a center of the substrate, through a liquid of a liquid immersion area which covers only a portion of a surface of the substrate, while moving the substrate at a first scanning speed; and (iii) exposing an other one of the shot areas through the liquid of the liquid immersion area, while moving the substrate at a second scanning speed lower than the first scanning speed. The other one of the shot areas is located near the edge of the substrate and the gap is included in the liquid immersion area during the exposure of the other one of the shot areas.
Public/Granted literature
- US20110211186A1 Exposure apparatus, exposure method and device manufacturing method Public/Granted day:2011-09-01
Information query
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