Invention Grant
- Patent Title: Electronic device
-
Application No.: US15045689Application Date: 2016-02-17
-
Publication No.: US10209736B2Publication Date: 2019-02-19
- Inventor: Yong-Beom Kim , Sin-Young Park , Bo-Won Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC.
- Priority: KR10-2015-0028205 20150227
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F3/041 ; B32B27/04
Abstract:
Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material having a bonding force in a selected range in a predetermined temperature range.
Public/Granted literature
- US20160253015A1 ELECTRONIC DEVICE Public/Granted day:2016-09-01
Information query
