Invention Grant
- Patent Title: Serial-bus interface for multi-die module
-
Application No.: US15340880Application Date: 2016-11-01
-
Publication No.: US10210130B2Publication Date: 2019-02-19
- Inventor: David Alan Podsiadlo , Yuji Shintomi
- Applicant: pSemi Corporation
- Applicant Address: US CA San Diego
- Assignee: pSemi Corporation
- Current Assignee: pSemi Corporation
- Current Assignee Address: US CA San Diego
- Agency: Jaquez Land Greenhaus LLP
- Agent Martin J. Jaquez, Esq.; John Land, Esq.
- Main IPC: H04L27/00
- IPC: H04L27/00 ; G06F13/20 ; G06F13/42 ; G06F13/40

Abstract:
Circuits and methods for efficient interconnect layout of multiple circuit elements, including integrated circuits (ICs), within a circuit module, while enabling only a single control/status (C/S) connection per module. In a first embodiment, the C/S interfaces of multiple ICs are configured in parallel within a multi-IC module, and coupled through a single module serial bus to a system C/S serial bus. In a second embodiment, the C/S interface of a primary IC is coupled through a single module serial bus to a system C/S serial bus, while a secondary IC is internally serially coupled to a “pass through” interface of the primary IC. In a third embodiment, a dynamic address translation circuit translates device and register address information provided by a master device into corresponding internal addresses, and re-directs command messages from a system C/S serial bus to internal slave devices.
Public/Granted literature
- US20180121384A1 Serial-Bus Interface for Mutli-Die Module Public/Granted day:2018-05-03
Information query