Invention Grant
- Patent Title: Wireless communication device, method for manufacturing same, seal fitted with RFIC element, and method for producing same
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Application No.: US15790095Application Date: 2017-10-23
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Publication No.: US10210449B2Publication Date: 2019-02-19
- Inventor: Noboru Kato , Kunihiro Komaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-227195 20141107; JP2015-044178 20150306
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; G06K19/07

Abstract:
In a wireless communication device, radiation conductors including a first and second end portions are reformed on an upper surface of a radiation conductor base material. First and second terminal electrodes are provided at a same or substantially the same interval as the first and second end portions, on a lower surface of a RFIC element. A seal includes an adhesive surface larger than a principal surface of the RFIC element. The RFIC element is arranged on the upper surface of the radiation conductor substrate so that each of the first and second terminal electrodes comes into contact with the first and second end portions. The seal is pasted to the radiation conductor substrate so as to cover the RFIC element.
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