The present disclosure relates to a system for monitoring structural health of bonded components includes an energy-harvesting device. The system also includes a damage-detection module powered by electrical energy from the energy-harvesting device. Further, the system includes electrically-conductive ink applied onto the bonded components and across an interface between the bonded components. The electrically-conductive ink forms an electrical circuit with the damage-detection module. Additionally, the system includes a visual-indication device electrically coupled with the damage-detection module. The visual-indication device is configured to visually indicate damage to the bonded components in response to receipt of electrical energy. The damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink.