Invention Grant
- Patent Title: Method of making a ceramic combo lid with selective and edge metallizations
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Application No.: US14718154Application Date: 2015-05-21
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Publication No.: US10211115B2Publication Date: 2019-02-19
- Inventor: Ramesh Kothandapani
- Applicant: Materion Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: MATERION CORPORATION
- Current Assignee: MATERION CORPORATION
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Main IPC: B23K1/20
- IPC: B23K1/20 ; H01L23/06 ; B23K1/00 ; B23K31/02 ; H01L23/04 ; H01L21/48 ; H01L23/08 ; H01L23/10 ; H01L21/50
Abstract:
A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.
Public/Granted literature
- US20150340298A1 CERAMIC COMBO LID WITH SELECTIVE AND EDGE METALLIZATIONS Public/Granted day:2015-11-26
Information query
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