A packaged semiconductor device includes a first package substrate having a first plurality of lead fingers, a first die attached to a first major surface of the first package substrate, a second package substrate having a second plurality of lead fingers, wherein each of the second plurality of lead fingers extends over the first die and the second package substrate is electrically isolated from the first package substrate. The device also includes a second die attached to a first major surface of the second package substrate, over the first die, and an encapsulant surrounding the first die, the first package substrate, the second die, and the second package substrate, wherein the encapsulant exposes a portion of the first package substrate and a portion of the second package substrate.