- Patent Title: Semiconductor device with diode region and trench gate structure
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Application No.: US15866755Application Date: 2018-01-10
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Publication No.: US10211306B2Publication Date: 2019-02-19
- Inventor: Ralf Siemieniec , Dethard Peters , Romain Esteve , Wolfgang Bergner , Thomas Aichinger , Daniel Kueck , Roland Rupp , Bernd Zippelius , Karlheinz Feldrapp , Christian Strenger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L29/739 ; H01L29/04 ; H01L29/423 ; H01L29/40 ; H01L29/16 ; H01L29/20

Abstract:
A semiconductor device includes a semiconductor body formed from a semiconductor material with a band-gap of at least 2.0 eV, the semiconductor body having a diode region and a source region. The semiconductor device further includes a trench gate structure having a first sidewall and a second sidewall opposite the first sidewall, the first sidewall and the second sidewall extending along a common longitudinal direction. A doping concentration of a first doping type is higher in the diode region than in the source region. The trench gate structure projects from a first surface of the semiconductor body into the semiconductor body. A first portion of the second sidewall at the first surface is directly adjoined by the source region. A second portion of the second sidewall is in direct contact with the diode region. Additional semiconductor device embodiments are provided.
Public/Granted literature
- US20180158920A1 Semiconductor Device with Diode Region and Trench Gate Structure Public/Granted day:2018-06-07
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