Invention Grant
- Patent Title: Light emitting diode apparatus and manufacturing method thereof
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Application No.: US15364806Application Date: 2016-11-30
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Publication No.: US10211384B2Publication Date: 2019-02-19
- Inventor: Jong-hoon Jung , Dae-sik Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0077322 20160621
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L33/64 ; H01L33/46

Abstract:
An LED apparatus is provided. The LED apparatus includes a plurality of substrate layers, each substrate layer corresponding to one of a plurality of sub-pixels of a pixel; a heat sink plate provided on a first side of each substrate layer, the heat sink plate including a patterned area provided between adjacent substrate layers of the plurality of substrates layers; a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers; and a plurality of light emitting diodes, each light emitting diode formed on a second side opposite to the first side of each substrate layer.
Public/Granted literature
- US20170279022A1 LIGHT EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-09-28
Information query
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