Invention Grant
- Patent Title: Apparatus and methods for wireless coupling
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Application No.: US14769203Application Date: 2013-02-22
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Publication No.: US10211537B2Publication Date: 2019-02-19
- Inventor: Ilkka Tahtinen
- Applicant: Nokia Technologies Oy
- Applicant Address: FI Espoo
- Assignee: NOKIA TECHNOLOGIES OY
- Current Assignee: NOKIA TECHNOLOGIES OY
- Current Assignee Address: FI Espoo
- Agency: Alston & Bird LLP
- International Application: PCT/FI2013/050196 WO 20130222
- International Announcement: WO2014/128339 WO 20140828
- Main IPC: H01Q13/16
- IPC: H01Q13/16 ; H01F38/14 ; H01Q1/22 ; H01Q13/10 ; H01Q5/321 ; H01Q1/24 ; H01Q1/36 ; H04B5/00
Abstract:
An apparatus (180) comprising: a first conductive layer (30) defining a first slot (46) having an open end and a closed end, the first slot (46) being configured to receive an inductive coupler (64) therein; and a capacitive member configured to tune the first conductive layer (30) to resonate in an operational frequency band.
Public/Granted literature
- US20150380827A1 APPARATUS AND METHODS FOR WIRELESS COUPLING Public/Granted day:2015-12-31
Information query
