Invention Grant
- Patent Title: Unified communications apparatus
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Application No.: US15456123Application Date: 2017-03-10
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Publication No.: US10211878B2Publication Date: 2019-02-19
- Inventor: Seung Pil Jung , Da Un Kim , Young Sik Jeon
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2016-0109342 20160826
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/44 ; H04B1/48 ; H04L5/14 ; H04W88/06

Abstract:
A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.
Public/Granted literature
- US20180062693A1 UNIFIED COMMUNICATIONS APPARATUS Public/Granted day:2018-03-01
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